? semiconductor components industries, llc, 2010 july, 2010 ? rev. 7 1 publication order number: mbrd1035ctl/d mbrd1035ctl switchmode schottky power rectifier dpak power surface mount package the mbrd1035ctl employs the schottky barrier principle in a large area metal ? to ? silicon power diode. state of the art geometry features epitaxial construction with oxide passivation and metal overlay contact. ideally suited for low voltage, high frequency switching power supplies, free wheeling diode and polarity protection diodes. features ? highly stable oxide passivated junction ? guardring for stress protection ? matched dual die construction ? may be paralleled for high current output ? high dv/dt capability ? short heat sink tap manufactured ? not sheared ? very low forward voltage drop ? epoxy meets ul 94 v ? 0 @ 0.125 in ? pb ? free packages are available mechanical characteristics: ? case: epoxy, molded ? weight: 0.4 gram (approximately) ? finish: all external surfaces corrosion resistant and terminal leads are readily solderable ? lead and mounting surface temperature for soldering purposes: 260 c max. for 10 seconds schottky barrier rectifier 10 amperes 35 volts 1 3 4 dpak case 369c marking diagram 1 2 3 4 http://onsemi.com yww b10 35clg y = year ww = work week b1035cl = device code g = pb ? free package see detailed ordering and shipping information in the package dimensions sect ion on page 2 of this data sheet. ordering information
mbrd1035ctl http://onsemi.com 2 maximum ratings rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 35 v average rectified forward current per leg (at rated v r , t c = 115 c) per package i o 5.0 10 a peak repetitive forward current per leg (at rated v r , square wave, 20 khz, t c = 115 c) i frm 10 a non ? repetitive peak surge current per package (surge applied at rated load conditions, halfwave, single phase, 60 hz) i fsm 50 a storage / operating case temperature t stg, t c ? 55 to +150 c operating junction temperature (note 1) t j ? 55 to +150 c voltage rate of change (rated v r , t j = 25 c) dv/dt 10,000 v/ s stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. 1. the heat generated must be less than the thermal conductivity from junction ? to ? ambient: dp d /dt j < 1/r ja . thermal characteristics thermal resistance, junction ? to ? case per leg r jc 3.0 c/w thermal resistance, junction ? to ? ambient (note 2) per leg r ja 137 c/w electrical characteristics maximum instantaneous forward voltage (note 3) (see figure 2) per leg i f = 5 amps, t j = 25 c i f = 5 amps, t j = 100 c i f = 10 amps, t j = 25 c i f = 10 amps, t j = 100 c v f 0.47 0.41 0.56 0.55 v maximum instantaneous reverse current (note 3) (see figure 4) per leg (v r = 35 v, t j = 25 c) (v r = 35 v, t j = 100 c) (v r = 17.5 v, t j = 25 c) (v r = 17.5 v, t j = 100 c) i r 2.0 30 0.20 5.0 ma 2. rating applies when using minimum pad size, fr4 pc board 3. pulse test: pulse width 250 s, duty cycle 2.0% ordering information device package shipping ? mbrd1035ctl dpak 75 units / rail MBRD1035CTLG dpak (pb ? free) 75 units / rail mbrd1035ctlt4 dpak 2500 units / tape & reel mbrd1035ctlt4g dpak (pb ? free) 2500 units / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d.
mbrd1035ctl http://onsemi.com 3 typical characteristics figure 1. typical forward voltage per leg figure 2. maximum forward voltage per leg figure 3. typical reverse current per leg 1.10 0.10 v f , instantaneous forward voltage (volts) 100 10 v r , reverse voltage (volts) 35 0 100e-6 1e-6 i f , instantaneous forward current (amps) i 1.0 0.50 0.30 0.70 0.90 10 20 30 10e-3 100e-3 0.1 , reverse current (amps) r 1e-3 10e-6 t j = 25 c t j = 100 c t j = 125 c t j = - 40 c t j = 125 c figure 4. maximum reverse current per leg 1.10 0.10 v f , maximum instantaneous forward voltage (volts) 100 10 i f , instantaneous forward current (amps) 1.0 0.50 0.30 0.70 0.90 0.1 t j = 25 c t j = 100 c t j = 125 c 1e+0 t j = 100 c t j = 25 c v r , reverse voltage (volts) 35 0 100e-6 1e-6 10 20 30 10e-3 100e-3 1e-3 10e-6 t j = 125 c 1e+0 t j = 100 c t j = 25 c i , maximum reverse current (amps) r
mbrd1035ctl http://onsemi.com 4 figure 5. current derating per leg figure 6. forward power dissipation per leg figure 7. capacitance per leg 120 0 t l , lead temperature ( c) 8.0 7.0 5.0 6.0 4.0 v r , dc reverse voltage (volts) 25 0 105 85 75 65 0 v r , reverse voltage (volts) 100 10 i o , average forward current (amps) c, capacitance (pf) 3.0 2.0 1.0 60 20 40 80 100 140 30 35 5101520 95 115 125 510152025 0 t j , derated opera ting temperature ( c) 1000 t j = 25 c freq = 20 khz i pk /i o = i pk /i o = 20 dc square wave (50% duty cycle) i o , average forward current (amps) 1.0 0 4.0 3.0 2.0 1.0 0 2.0 p fo , average power dissipation (watts) 3.0 4.0 5.0 6.0 7.0 8.0 3.5 2.5 1.5 0.5 i pk /i o = 20 square wave (50% duty cycle) dc figure 8. typical operating temperature derating per leg * i pk /i o = 10 i pk /i o = 5 i pk /i o = 10 i pk /i o = 5 i pk /i o = r ja = 84 c/w r ja = 67.5 c/w r ja = 48 c/w r ja = 25 c/w r ja = 2.43 c/w * reverse power dissipation and the possibility of thermal runaway must be considered when operating this device under any reverse voltage conditions. calculations of t j therefore must include forward and reverse power ef fects. the allowable operating t j may be calculated from the equation: t j = t jmax ? r(t)(pf + pr) where r(t) = thermal impedance under given conditions, pf = forward power dissipation, and pr = reverse power dissipation this graph displays the derated allowable t j due to reverse bias under dc conditions only and is calculated as t j = t jmax ? r(t)pr, where r(t) = rthja. for other power applications further calculations must be performed.
mbrd1035ctl http://onsemi.com 5 figure 9. thermal response junction to case (per leg) figure 10. thermal response junction to ambient (per leg) 0.1 0.00001 t, time (s) 1.0 0.1 0.01 r 0.0001 0.001 0.01 , transient thermal resistance (normalized) (t) 1.0 10 100 1000 50%(duty cycle) 20% 10% 5.0% 2.0% 1.0% r tjl(t) = r tjl ? r (t) 0.1 0.00001 t, time (s) 1.0e+00 1.0e-01 1.0e-02 1.0e-03 1.0e-04 0.0001 0.001 0.01 1.0 10 100 10000 50% (duty cycle) 20% 10% 5.0% 2.0% 1.0% single pulse r , transient thermal resistance (normalized) (t) 1000 single pulse r tjl(t) = r tjl ? r (t)
mbrd1035ctl http://onsemi.com 6 package dimensions dpak (single gauge) case 369c ? 01 issue d b d e b3 l3 l4 b2 e m 0.005 (0.13) c c2 a c c z dim min max min max millimeters inches d 0.235 0.245 5.97 6.22 e 0.250 0.265 6.35 6.73 a 0.086 0.094 2.18 2.38 b 0.025 0.035 0.63 0.89 c2 0.018 0.024 0.46 0.61 b2 0.030 0.045 0.76 1.14 c 0.018 0.024 0.46 0.61 e 0.090 bsc 2.29 bsc b3 0.180 0.215 4.57 5.46 l4 ??? 0.040 ??? 1.01 l 0.055 0.070 1.40 1.78 l3 0.035 0.050 0.89 1.27 z 0.155 ??? 3.93 ??? notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: inches. 3. thermal pad contour optional within dimensions b3, l3 and z. 4. dimensions d and e do not include mold flash, protrusions, or burrs. mold flash, protrusions, or gate burrs shall not exceed 0.006 inches per side. 5. dimensions d and e are determined at the outermost extremes of the plastic body. 6. datums a and b are determined at datum plane h. 12 3 4 5.80 0.228 2.58 0.102 1.60 0.063 6.20 0.244 3.00 0.118 6.17 0.243 mm inches scale 3:1 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* h 0.370 0.410 9.40 10.41 a1 0.000 0.005 0.00 0.13 l1 0.108 ref 2.74 ref l2 0.020 bsc 0.51 bsc a1 h detail a seating plane a b c l1 l h l2 gauge plane detail a rotated 90 cw on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. sc illc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems in tended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hol d scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising ou t of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding th e design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resa le in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5773 ? 3850 mbrd1035ctld literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loca l sales representative
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